|
active element
|
有源元件
|
|
dry-film lithography
|
干膜光刻
|
|
active regions
|
有源区
|
electro migration
|
电子迁移
|
|
amorphous layer
|
非晶层
|
etching
|
刻蚀
|
|
anisotropic etching
|
各向异性蚀刻
|
extension
|
延伸，延伸部
|
|
base film
|
基膜
|
external terminal
|
外部端子
|
|
bidirectional diode
|
双向二极管
|
film resist
|
薄膜抗蚀层
|
|
bump
|
凸块，凸点，突起
|
flip-chip
|
倒装芯片
|
|
cache
|
高速缓存
|
floating diffusion region
|
浮置扩散区
|
|
casing
|
壳体
|
floating gate
|
浮动栅极
|
|
CCD (Charge Coupled Device)
|
电荷耦合装置
|
ground layer
|
接地层
|
|
channel
|
沟道，通路
|
hetero atom
|
杂原子
|
|
chemical dry etching
|
化学干蚀刻
|
heterocyclic compound
|
杂环化合物
|
|
chip on chip
|
芯片上芯片
|
imaging device
|
成像器件
|
|
coating
|
涂布
|
impurity diffusion region
|
杂质扩散区域
|
|
coating film
|
涂膜
|
impurity layer
|
杂质层
|
|
computer-readablestorage medium
|
计算机可读存储介质
|
injection
|
注入
|
|
conductive-film
|
导电膜
|
interlayer insulating film
|
层间绝缘膜
|
|
copper foil
|
铜箔
|
ion implantation
|
离子注入
|
|
core layer
|
核心层，芯层
|
isolation insulating film
|
隔离绝缘膜
|
|
CVD (Chemical Vapor Deposition )
|
化学气相沉积
|
laminated structure
|
层叠结构
|
|
device
|
器件
|
land
|
焊接区，焊盘
|
|
dielectric material
|
介电材料
|
layout
|
布局
|
|
diffusion layer
|
扩散层
|
lead pin
|
引脚
|
|
drain
|
漏极
|
lead wiring
|
引线
|
|
dry etching
|
干法刻蚀
|
LSI (Large Scale Integrated-circuit)
|
大规模集成电路
|
|
mask
|
掩模，屏蔽
|
pitch
|
间距，节距，管脚间距
|
|
mask film
|
掩模，掩模层
|
PLA (PLasma Annealing)
|
等离子体退火
|
|
metal mask
|
金属掩膜
|
plasma
|
等离子体
|
|
metal wiring
|
金属布线
|
plasma etching
|
等离子体蚀刻
|
|
microcrystalline structure
|
微晶结构
|
polysilicon
|
多晶硅
|
|
micro-mirror element
|
微镜元件
|
reactive ion etching
|
反应离子刻蚀方法
|
|
mold resin
|
模制树脂
|
self-alignment
|
自对准
|
|
nonvolatile memory
|
非易失性存储器
|
semiconductor chip
|
半导体芯片
|
|
opening
|
开口
|
semiconductor device
|
半导体器件
|
|
oxidation atmosphere
|
氧化气氛
|
semiconductor element
|
半导体元件
|
|
oxidation preventing insulating film
|
防氧化绝缘膜
|
shielding layer
|
屏蔽层
|
|
oxide film
|
氧化膜
|
silicon oxide
|
氧化硅
|
|
package base
|
封装基底
|
solid-state image sensor
|
固态图像传感器
|
|
pad electrode
|
焊盘电极
|
source
|
源极
|
|
pad pitch
|
焊盘间距
|
source diffusion layer
|
源扩散层
|
|
passive element
|
无源元件
|
substrate
|
基板，衬底
|
|
pattern
|
图案
|
thin film device
|
薄膜器件
|
|
peripheral circuit region
|
外围电路区
|
through hole
|
通孔
|
|
phase shift mask
|
相移掩模
|
tunnel barrier layer
|
隧道阻挡层
|
|
photo process
|
光刻工艺
|
tunnel oxide film
|
隧道氧化膜
|
|
photodiode region
|
光电二极管区
|
VVD (Vacuum Vapor Deposition)
|
真空气相沉积
|
|
photolithography
|
光刻
|
wafer
|
晶片
|
|
photo-resist
|
光刻胶，光致抗蚀剂
|
wafer process
|
晶片处理
|
|
pin
|
引脚，针，销
|
wiring
|
布线
|
|
pin terminal
|
接线端子
|
wiring layer
|
接线层，布线层
|